Day 1
Module 1 : Signal Integrity Challenges for Spacecraft Avionics
- Analogue and digital sub-system, signal-integrity challenges
Module 2 : Signal Quality & Cross Talk
- Transmission lines, signal termination, impedance matching, EMI and cross talk
Module 3 : Power Distribution & Decoupling
- How to optimise the number, type, location and orientation of decoupling capacitors
Module 4 : Pre-Layout Verification using Mentor Graphics' EDA Tools
- Analog and digital simulation using Linesim and Hyperlynx Analog
Module 5 : Post-Layout Verification using Mentor Graphics' EDA Tools
- Analog and digital simulation using Boardsim and Hyperlynx Analog
Module 6 : High-Speed Serial Links
- Signal integrity and IBIS-AMI simulation
Module 7 : PCB Stack-Up Design-for-EMC & Heatsinking
- Right-first-time, PCB stack-up design, design-for-EMC and using your PCB as the heatsink
Module 8 : Signal Integrity and ESCC-Q-ST-70
- Ensuring your hardware designs are ESA compliant!